4-Chip Laser Module with Fiber Bundle
$3,350.00
SemiNex’s Multi-Chip Module family of lasers provides customers with extraordinary high power in a bundled fiber output. Laser modules are provided across the InP spectrum of 12xx to 19xx with numerous power and fiber options. Lower power and lower price versions are available in different configurations. In addition SemiNex offers high brightness modules for those applications requiring a single fiber and higher power.
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Wavelength: 1555 nm
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Aperture: 350 um
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Mode: Multi Mode
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Junction: Single
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Aiming beam
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Photodiode
Symbol | Value | Units | |
---|---|---|---|
Optical | |||
Wavelength | λc | nm(+/-20) | |
Output Power (CW) | Po | watts | |
Spectral Width | Δλ | nm 3dB | |
Cavity Length | CL | μm | |
Junction Type | |||
Emitter Height | H | μm | |
Temp. Coefficient | Δλ/ΔλT | nm/C | |
Slope Efficiency | ηo | W/A | |
Slow Axis Divg. | θ_parallel | deg FWHM | |
Fast Axis Divg. | θ_perp | deg FWHM | |
Number of emitters | |||
Pulse Width | PW | ns | |
Duty Cycle | DC | % |
Symbol | Value | Units | |
---|---|---|---|
Electrical | |||
Power Conversion Eff. | η | Min | |
Operating Current | Iop | A | |
Operating Voltage | Vop | V | |
Series Resistance | Rs | ohm | |
Photodiode Current | Im | mA | |
Aiming Beam - Current Limit | Imax | mA | |
Aiming Beam - Output Power | Pa | mW | |
Aiming Beam - Wavelength | λa | nm |
Symbol | Value | Units | ||
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Mechanical | ||||
Fiber Length | Meters | |||
Connector | ||||
Lead Soldering Temp. | °C | |||
Weight | g | |||
Operating Temp. | °C |
Other | |
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Specification Notes | Specified values are rated at a constant heat sink temperature of 20oC. |
SemiNex delivers the highest available power at infrared wavelengths between 12xx and 19xx nm. When necessary we will further optimize the design of our InP laser chips to meet our customers’ specific optical and electrical performance needs. Diodes, bars and packages are tested to meet customer and market performance demands. Typical results and packaging options are shown. Contact SemiNex for additional details or to discuss your specific requirements.Click here to see product information sheet
Applications
Features