7-Chip Laser Module with Fiber Bundle

$3,995.00

SKU: 52 Part Number: MCM-103

SemiNex’s Multi-Chip Module family of lasers provides customers with extraordinary high power in a bundled fiber output. Laser modules are provided across the InP spectrum of 12xx to 19xx with numerous power and fiber options. Lower power and lower price versions are available in different configurations. In addition SemiNex offers high brightness modules for those applications requiring a single fiber and higher power.
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  • Wavelength: 1475 nm

  • Aperture: 375 um

  • Mode: Multi Mode

  • Junction: Single

  • Photodiode

Symbol Value Units
Optical
Wavelength λc

nm(+/-20)
Output Power (CW) Po

watts
Spectral Width Δλ

nm 3dB
Cavity Length CL

μm
Junction Type

Emitter Height H

μm
Temp. Coefficient Δλ/ΔλT

nm/C
Slope Efficiency ηo

W/A
Slow Axis Divg. θ_parallel

deg FWHM
Fast Axis Divg. θ_perp

deg FWHM
Number of emitters

Pulse Width PW

ns
Duty Cycle DC

%
Symbol Value Units
Electrical
Power Conversion Eff. η

Min
Operating Current Iop

A
Operating Voltage Vop

V
Series Resistance Rs

ohm
Photodiode Current Im

mA
Aiming Beam - Current Limit Imax

mA
Symbol Value Units
Mechanical
Fiber Length

Meters
Connector

Lead Soldering Temp.

°C
Weight

g
Operating Temp.

°C
Symbol Value Units
Laser Engine Misc
LE X Axis Divergence θ_X

deg FWHM
LE Y Axis Divergence θ_Y

deg FWHM
Other
Specification Notes

Export license is not required for shipment to the US and most of Europe. For shipments to other countries please click this hyperlink to Regulation Number 6A995.

SemiNex delivers the highest available power at infrared wavelengths between 12xx and 19xx nm. When necessary we will further optimize the design of our InP laser chips to meet our customers’ specific optical and electrical performance needs. Diodes, bars and packages are tested to meet customer and market performance demands. Typical results and packaging options are shown. Contact SemiNex for additional details or to discuss your specific requirements.
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Applications

  • OEM Medical
  • DPSS pump source
  • Free Space Communications
  • Military / Aerospace
  • Thermal Processing

    b>Features

  • High Power Multi Chip Laser Assembly
  • Fiber Bundle Assembly for low cost
  • High Dynamic Range
  • High Efficiency
  • Red Aiming Beam Optional
  • Designed for Volume Applications