4-Chip Laser Module with Fiber Bundle

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4-Chip Laser Module with Fiber Bundle

SKU: 50

Part Number: MCM-101

Availability: Lead time: Call

SemiNex's Multi-Chip Module family of lasers provides customers with extraordinary high power in a bundled fiber output. Laser modules are provided across the InP spectrum of 12xx to 19xx with numerous power and fiber options. Lower power and lower price versions are available in different configurations. In addition SemiNex offers high brightness modules for those applications requiring a single fiber and higher power.
Click here to see product information sheet
  • Wavelength: 1465 nm

  • Power: 10 W CW

  • Aperture:  350 um

  • Mode: Multi Mode

  • Aiming beam

  • Photodiode

Symbol Value Units
Wavelength λc 1465 nm(+/-20)
Output Power (CW) Po 10 watts
Spectral Width Δλ 10 nm 3dB
Emitter Width W 350 μm
Temp. Coefficient Δλ/ΔλT 0.55 nm/C
Slope Efficiency ηo 1 W/A
Slow Axis Divg. θ_parallel 12 deg FWHM
Fast Axis Divg. θ_perp 12 deg FWHM
Number of emitters   4  
Duty Cycle DC 100 %
Power Conversion Eff. η 20 Min
Threshold Current Ith 0.7 A
Operating Current Iop 7.5 A
Operating Voltage Vop 6 V
Series Resistance Rs 0.3 ohm
Aiming Beam - Output Power Pa 2 mW
Aiming Beam - Wavelength λa 650 nm
Optical Fiber Core Dia. 350 μm
Optical Fiber NA NA 0.22
Fiber Length 1.5 Meters
Connector SMA905
Lead Soldering Temp. 250 °C
Storage Temp. -40 to 80 °C
Weight 515 g
Operating Temp. -40 to 60 °C
Laser Engine Misc
LE X Axis Divergence θ_X 12 deg FWHM
LE Y Axis Divergence θ_Y 12 deg FWHM
Specified values are rated at a constant heat sink temperature of 20oC.

Export license is not required for shipment to the US and most of Europe. For shipments to other countries please click this hyperlink to Regulation Number 6A995.



SemiNex delivers the highest available power at infrared wavelengths between 12xx and 19xx nm. When necessary we will further optimize the design of our InP laser chips to meet our customers' specific optical and electrical performance needs. Diodes, bars and packages are tested to meet customer and market performance demands. Typical results and packaging options are shown. Contact SemiNex for additional details or to discuss your specific requirements.
Click here to see product information sheet


  • OEM Medical
  • DPSS pump source
  • Free Space Communications
  • Military / Aerospace
  • Thermal Processing

  • High Power Multi Chip Laser Assembly
  • Fiber Bundle Assembly for low cost
  • High Dynamic Range
  • High Efficiency
  • Red Aiming Beam Optional
  • Designed for Volume Applications

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