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Data Center

AI Data Centers & High-Performance Computing

High-power DFB lasers and SOAs for AI data centers and silicon photonics

 

Enabling the Transition from Pluggables to CPO

As AI systems move from traditional pluggable optics toward co-packaged optical solutions, optical power requirements increase while thermal margins tighten.

SemiNex supports this transition by delivering:

    • High optical output power for low-loss PIC coupling
    • Robust operation at elevated temperatures
    • Scalable discrete solutions aligned with silicon photonics strategies

We enable today’s ELSFP deployments and tomorrow’s CPO systems.

 

 

Advantages

  1. Wavelengths: 13xx, 15xx
  2. High optical output power
  3. Best-in-class high temperature performance
  4. Longer data reach
  5. Single emitter or multi channel array

Select Wavelength for Products

Related Packages

Chip on Carrier
Chip on Carrier: 1550nm
Mini Bar
Mini Bar: 1550nm
14-PIN Butterfly
14-PIN Butterfly: 1550nm
Multi Chip Module
Multi Chip Module: 1550nm

SemiNex technologies deliver high optical power at elevated temperatures

High Gain and High Output Power

Advanced epitaxial and waveguide designs deliver high optical output power for data center interconnects operating in thermally demanding environments.

Multi-Wavelength

Optimized for multi-wavelength optical links enabling high-bandwidth data center fabrics and scale-out/ scale-up interconnects.

Si PIC Integration

Engineered for seamless integration with silicon photonic integrated circuits, supporting ELSFP, NPO, and emerging co-packaged optical architectures.

Cost Effective Solutions

Designed for power efficiency and scalable deployment, delivering higher optical performance per watt in data center environments.

Custom OEM Solutions

SemiNex readily offers customizable laser diode and SOA products to best suit your needs.